Tower Semiconductor and Tianyi Micro Announce Strategic Cooperation in Development of Next Generation OLED Micro Displays for AR/VR - Seite 2

Tower’s platform offers several strategic advantages such as high resolution, high brightness, excellent yield, and display uniformity. It’s dedicated flows for display backplanes include custom low leakage devices, high voltage (up to 10V) pixels for high brightness displays, and in-pixel MIM capacitors, as well as tailor-made back end for customer-specific requirements (customized anodes, protective layers, custom CMP). These flows include complete process/device offerings, silicon results and PDK support with very accurate modeling. They are available in full flow or lean flow for high yield 2-chip solutions.

“We value long-term cooperations that yield progress and technological advancements. Our collaboration with Tianyi Micro in micro display technology development is a perfect example for such a process, which extended our offering to include dedicated flows for micro display application”, said Dr. Avi Strum, Senior Vice President and CTO, Tower Semiconductor. “Like CMOS Image Sensors before, OLED Micro-displays have reached a point where standard CMOS flows are not meeting the image quality requirements. Future Displays call for a dedicated flow with customized devices for yield and performance. With projects that began on our 180nm and continued to 65nm high voltage platform for next-generation micro displays, we are proud to continue our collaboration and drive solutions that deliver mutual success”.

Tower will be presenting this exciting technology and recent relevant developments in upcoming SEMICON China on March 20, 2024, at 11:30 am: Advanced CMOS Process Technology for Micro Display Manufacturing by Dr. Benoit Dupont, Sensors and Display Marketing Director, Tower Semiconductor.

For additional information about Tower Semiconductor’s micro displays technology offerings, please visit here.

For additional information about Tower Semiconductor’s CMOS image sensors technology offerings, please visit here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor owns two facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo, a 300mm facility in Agrate, Italy, shared with ST as well as a 300mm capacity corridor in Intel’s New Mexico factory. For more information, please visit: www.towersemi.com.