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Intel Accelerates Process and Packaging Innovations

Nachrichtenquelle: Business Wire (engl.)
26.07.2021, 23:00  |  159   |   |   

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210726005136/en/

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Pat Gelsinger, CEO of Intel Corporation, speaks during a virtual presentation as part of the "Intel Accelerated" event on July 26, 2021. At the event, Intel presented the company's future process and packaging technology roadmaps. (Credit: Intel Corporation)

Pat Gelsinger, CEO of Intel Corporation, speaks during a virtual presentation as part of the "Intel Accelerated" event on July 26, 2021. At the event, Intel presented the company's future process and packaging technology roadmaps. (Credit: Intel Corporation)

“Building on Intel’s unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025,” Intel CEO Pat Gelsinger said during the global “Intel Accelerated” webcast. “We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore’s Law and our path to innovate with the magic of silicon.”

More: Process & Packaging Innovations (Press Kit) | “Intel Accelerated” Webcast (Event Livestream/Replay) | Accelerating Process Innovation (Fact Sheet) | Accelerating Process Innovation (Quotes) | Intel Introduces New RibbonFET and PowerVia Technologies (Video) | Intel EMIB Technology Explained (Video) | Intel Foveros Technology Explained (Video)

The industry has long recognized that traditional nanometer-based process node naming stopped matching the actual gate-length metric in 1997. Today, Intel introduced a new naming structure for its process nodes, creating a clear and consistent framework to give customers a more accurate view of process nodes across the industry. This clarity is more important than ever with the launch of Intel Foundry Services. “The innovations unveiled today will not only enable Intel’s product roadmap; they will also be critical for our foundry customers,” Gelsinger said. “The interest in IFS has been strong and I’m thrilled that today we announced our first two major customers. IFS is off to the races!”

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Intel Accelerates Process and Packaging Innovations Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to …

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