TSMC FinFlex, N2 Process Innovations Debut at 2022 North America Technology Symposium - Seite 2

Expanding Ultra -Low Power Platform - Building on the success of the N12e technology announced at the 2020 Technology Symposium, TSMC is developing N6e, the next evolution in process technology tuned to provide the computing power and energy efficiency required by edge AI and IoT devices. N6e will be based on TSMC’s advanced 7nm process and is expected to have three times greater logic density than N12e. It will serve as a part of TSMC’s Ultra-Low Power platform, a comprehensive portfolio of logic, RF, analog, embedded nonvolatile memory, and power management IC solutions aimed at applications in edge AI and the Internet of Things.

TSMC 3DFabric 3D Silicon Stacking Solutions - TSMC is showcasing two groundbreaking customer applications of the TSMC-SoIC chip stacking solution:

1. The world’s first SoIC-based CPU employing Chip-on-Wafer (CoW) technology to stack SRAM as a Level 3 cache
2. A groundbreaking intelligence processing unit stacked on top of a deep trench capacitor die using Wafer-on-Wafer (WoW) technology.

With N7 chips already in production for both CoW and WoW, support for N5 technology is scheduled for 2023. To meet customer demand for SoIC and other TSMC 3DFabric system integration services, the world’s first fully automated 3DFabric factory is set to begin production in the second half of 2022.

About TSMC

TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.

TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.

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