STMicroelectronics breaks the 20nm barrier for cost-competitive next-generation microcontrollers - Seite 2

The technology also delivers the reliability required for demanding industrial applications thanks to robust high-temperature operation, radiation hardening, and data retention capabilities already proven in automotive applications.

Additional information on FD-SOI and PCM is available on ST.com.

Benefits to STM32 microcontroller developers and customers

Microcontrollers based on this technology will bring developers a new class of high-performance, low-power, and wireless MCUs. The large memory sizes support the growing needs of edge AI processing, multi-protocol RF stacks, over-the-air updates, and advanced security features. The high performance and large memory size capabilities will give developers using microprocessors today the option to use more highly integrated and cost-effective microcontrollers for their designs. And it will allow further steps in power efficiency for ultralow power devices where ST’s portfolio is industry-leading today.

The first microcontroller based on this technology will integrate the most advanced ARM Cortex-M core, providing enhanced performance for machine learning and digital signal processing applications. It will offer fast and flexible external memory interfaces, advanced graphic capabilities and will integrate numerous analog and digital peripherals. It will also have the advanced, certified security features already introduced on ST’s latest MCUs.

About STMicroelectronics

At ST, we are over 50,000 creators and makers of semiconductor technologies mastering the semiconductor supply chain with state-of-the-art manufacturing facilities. An integrated device manufacturer, we work with more than 200,000 customers and thousands of partners to design and build products, solutions, and ecosystems that address their challenges and opportunities, and the need to support a more sustainable world. Our technologies enable smarter mobility, more efficient power and energy management, and the wide-scale deployment of cloud-connected autonomous things. We are committed to achieving our goal to become carbon neutral on scope 1 and 2 and partially scope 3 by 2027.

Further information can be found at www.st.com.

For further information, please contact:

INVESTOR RELATIONS:
Céline Berthier
Group VP, Investor Relations
Tel: [phone]
[e-mail]

MEDIA RELATIONS:
Alexis Breton
Corporate External Communications
Tel: [phone]
[e-mail]

Attachments

• C3244C -- Mar 19 2024 -- 18nm FD-SOI for next-gen STM32 MCUs_FINAL FOR PUBLICATION
• C3244C -- Mar 19 2024 -- 18nm FD-SOI for next-gen STM32 MCUs_IMAGE