Toshiba and Western Digital Reach Global Settlement and Agree to Strengthen Flash Memory Collaboration - Seite 3

Forward-Looking Statements

This news release contains certain forward-looking statements, including statements concerning: the NAND flash memory joint ventures; the global settlement agreement and the resolution of outstanding legal disputes; investments in Fab 6; Western Digital’s participation in TMC’s wafer fabrication facility to be constructed in Iwate, Japan; the production of 3D flash memory and demand in the flash memory market; Toshiba’s transaction with the consortium led by Bain Capital; a potential initial public offering by TMC; and expectations and objectives with respect to the NAND flash memory joint ventures. There are a number of risks and uncertainties that may cause these forward-looking statements to be inaccurate including, among others: uncertainties with respect to the NAND flash memory joint ventures; volatility in global economic conditions; business conditions and growth in the storage ecosystem; impact of competitive products and pricing; market acceptance and cost of commodity materials and specialized product components; actions by competitors; unexpected advances in competing technologies; the development and introduction of products based on new technologies and expansion into new data storage markets; risks associated with acquisitions, mergers and joint ventures; difficulties or delays in manufacturing; and other risks and uncertainties listed in Western Digital’s filings with the Securities and Exchange Commission (the "SEC"), including Western Digital’s Form 10-Q filed with the SEC on Nov. 7, 2017, to which your attention is directed. You should not place undue reliance on these forward-looking statements, which speak only as of the date hereof, and Western Digital undertakes no obligation to update these forward-looking statements to reflect subsequent events or circumstances.

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