ASE launches its Integrated Design EcosystemTM to enable silicon package design efficiencies that reduce cycle time by half - Seite 2

Advanced wafer level RDL/Si interposer auto-routing:
By incorporating a robust auto-routing and embedded design rule check at the advanced wafer level RDL/Si interposer design layout phase, much of the task can be automated thereby reducing the cycle time by 50% accordingly. As the design process expands beyond the silicon and substrate, new methodologies to enhance electrical performance are required to address other separate routing layers created in either wafer level RDL stacks or Si interposers.

The ASE IDE is ideal for optimizing the design of VIPack structures geared towards artificial intelligence (AI) and machine learning (ML), high-performance computing (HPC), 5G communication networks, autonomous transportation, and consumer electronics. ASE’s Director of Engineering & Technical Promotion, Charles Lee, observed, “Advanced packaging helps create the magic of what is possible across today’s dynamic application landscape, therefore the IDE is a crucial step forward for ASE in our endeavor to bring the most systematic package design enablement to our customers.”

“ASE’s launch of the IDE elevates our package design efficiency and signifies our commitment to deliver the performance, cost, and time-to-market benefits our customers need to stay competitive,” commented Dr. CP Hung, Vice President of R&D, ASE. “While ASE has been in production with 2.5D for nearly ten years, package complexity continues to rise and the new design methodologies within IDE set ASE apart.”

“Our business is built on driving the technology and innovation required to bring greater value to our customers,” remarked Yin Chang, ASE’s Senior Vice President of Sales & Marketing. “ASE has been extremely intentional in terms of collaborating more closely across the EDA ecosystem and helping to drive design tool improvements that are bringing unprecedented levels of performance and efficiency to advanced packaging creativity.”

ASE’s IDE underpins VIPack, a scalable platform that is expanding in alignment with industry roadmaps. The IDE PDK is available upon request and under NDA.

Supporting resources

• For more about IDE, please visit: ase.aseglobal.com/ide/
• For more about VIPack, please visit: ase.aseglobal.com/vipack/
• Follow us on our LinkedIn page for targeted updates and announcements @aseglobal
• Follow us on Twitter @aseglobal

About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including 5G, AI, Automotive, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.

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The ASE Technology Holding Stock at the time of publication of the news with a raise of +1,40 % to 7,25EUR on Tradegate stock exchange (03. Oktober 2023, 09:48 Uhr).