"Places2Be" project to boost European leadership around FD-SOI - the faster, cooler, simpler chip technology - Seite 2

 

Note to editors

Places2Be members (in alphabetic order)
            · ACREO Swedish ICT AB, Sweden
            · Adixen Vacuum Products, France
            · Axiom IC, Netherlands
            · Bruco Integrated Circuits, Netherlands
            · Commissariat à l'énergie atomique et aux énergies alternatives, France
            · Dolphin Integration, France
            · Ericsson AB, Sweden
            · eSilicon Romania S.r.l., Romania
            · Forschungzentrum Jülich Gmbh, Germany
            · GlobalFoundries Dresden, Germany
            · Grenoble INP, France
            · IMEC Interuniversitair Micro-Electronica Centrum vzw, Belgium
            · Ion Beam Services, France
            · Mentor Graphics France Sarl, France
            · SOITEC SA, France
            · ST-Ericsson
            · STMicroelectronics (Crolles2 SAS, SA, Grenoble SAS), France
            · Université Catholique de Louvain, Belgium
            · University of Twente, Netherlands

Countries involved:
            · Belgium
            · Finland
            · France
            · Germany
            · Romania
            · Sweden
            · The Netherlands

About FD-SOI
FD-SOI stands for "Fully-Depleted Silicon-On-Insulator." This technology improves the electrostatic control of the transistor channel, improving transistor performance and power efficiency. More precisely Places2Be uses Ultra-Thin Body and Buried oxide (UTBB) FD-SOI, which allows the dynamic tuning of transistor performance, from low power to high speed, during operation. A video introduction to this technology is available on YouTube: www.youtube.com/watch?v=S_wMzAEajO0&list=UUU5iH94nyLSQAn6SgDM9lag&index=1

About the ENIAC JU
The ENIAC Joint Undertaking (JU) is a public-private partnership on nanoelectronics bringing together the ENIAC member States, the European Union, and AENEAS (an association representing European R&D actors in this field).

It coordinates research activities through competitive calls for proposals to enhance the further integration and miniaturization of devices, and increase their functionalities. It shall deliver new materials, equipment and processes, new architectures, innovative manufacturing processes, disruptive design methodologies, new packaging and 'systemising' methods. It will drive and be driven by innovative high-tech applications in communication and computing, transport, health care and wellness, energy and environmental management, security and safety, and entertainment.