ASE’s VIPack Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets - Seite 2

“Our customers require transformative technologies that enable their product roadmaps, and advanced interconnect technologies such as micro bump, in combination with the VIPack structures, help to address performance, power, and latency challenges,” added Mark Gerber, ASE’s Senior Director of Engineering & Technical Marketing. “ASE’s advanced interconnect technologies present compelling options for customers that seek increasingly finer pitch solutions for overall performance improvement, scalability achievement, and power advantage.”

“We are pleased that ASE’s VIPack momentum continues through creative interconnect innovations that overcome limitations and align with dynamic application requirements,” added Yin Chang, Senior Vice President of Sales & Marketing at ASE. “At ASE, we empower our customers to explore and discover new performance and sustainable efficiencies in every single semiconductor design and system solution.”

ASE’s VIPack is a scalable platform that is expanding in alignment with industry roadmaps, supported by its Integrated Design Ecosystem (IDE), a collaborative design toolset optimized to systematically boost advanced package architecture.

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About ASE, Inc.

ASE, Inc. is the leading global provider of semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established assembly and test technologies, ASE is also delivering innovative advanced packaging and system-in-package solutions to meet growth momentum across a broad range of end markets, including AI, Automotive, 5G, High-Performance Computing, and more. To learn about our advances in SiP, Fan-out, MEMS & Sensor, Flip Chip, and 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: aseglobal.com or follow us on Twitter: @aseglobal.

View source version on businesswire.com: https://www.businesswire.com/news/home/20240320843248/en/

The ASE Technology Holding Stock at the time of publication of the news with a raise of 0,00 % to 10,20EUR on Tradegate stock exchange (19. März 2024, 22:26 Uhr).