Global Ultra-low Alpha Metal Market

Rising Usage of Alternate Alloys in Soldering Applications Produces Rewarding Opportunities, Finds TMR

ALBANY, New York, January 24, 2018 /PRNewswire/ --

The global ultra-low alpha metal market has been studied to witness the presence of some of the powerful names in the industry, viz. Alpha Assembly Solutions, Pure Technologies, Mitsubishi Materials Corporation, Tech Resources Limited, and Honeywell International Inc. Transparency Market Research (TMR) has prognosticated market players to face a moderate level of competition in the near future. Players could look to widen their product portfolios with a view to have an upper hand over their competitors. A majority of players have been manufacturing products that would suit the requirements of the automotive and aviation industries experiencing a boom in their growth.

TMR has expected the global ultra-low alpha metal market to expand at a 7.4% CAGR between 2017 and 2025 to earn a US$4.9 bn by the end of the forecast tenure. In 2017, the market had earnings of US$2.7 bn. By product, the market has been divided into ultra-low alpha lead-free alloys, ultra-low alpha lead alloys, ultra-low alpha tin alloys, and ultra-low alpha tin. Regionally, Asia Pacific has been anticipated to grab a major share of the market by the final forecast year while earning a US$3.1 bn.

Get PDF Brochure for more Professional & Technical industry insights: https://www.transparencymarketresearch.com/sample/sample.php?flag=B&re ...

High Utilization for Soldering Fabrication in Flip Chip Technology Sector Ups Demand 

The world ultra-low alpha metal market has been prophesied to gain a significant demand owing to a heavy engagement in soldering applications. In the flip chip technology domain, ultra-low alpha metal is chiefly used in soldering fabrication: for instance, solder microspheres and copper pillar solder caps are required in advanced flip chip and 3D wafer-level chip packages. Moreover, it could be used in circuit boards, semiconductor packaging, printed circuit boards (PCBs), bumping, and plating. These components are employed in a number of industries such as telecommunication, automotive, aviation, medical, and electronics.

Even though alloys containing silver are priced relatively expensive, they have been opted by several manufacturers for soldering applications. Such factors have been predicted to boost the engagement of ultra-low alpha metal. End-user industry applications primarily demand ultra-low alpha metal for zero-defect wave soldering requiring a consistent quality of solders. All of these factors have been projected to noticeably improve the demand in the world ultra-low alpha metal market.