GBT Intellectual Properties Portfolio Update - Seite 2

"We are pleased to announce the issuance of one of our major EDA patents, the Phi patent describes a technology that can read circuit specifications, process rules, and constraints to automatically generate the IC's layout block. This block can be used for various other projects. If another circuit is needed, the technology can easily generate it from scratch" said Danny Rittman, GBT's CTO.

Tokenize's predictive technology patent was granted on November 7, 2023, US Patent #: 11,809,797. The patent describes systems and methods to design and manufacture three-dimensional, multi-planar semiconductors. The technology uses AI to predict the best 3D, multi-planar shape for an integrated circuit (IC) manufacturing process. The described system considers various factors, including geometrical design rules, electrical specifications, reliability constraints, and DFM (Design for Manufacturing) guidelines. The key benefits of the described predictive technology are improved silicon yield, performance increase, power consumption reduction, and improved reliability. The invention's technology significantly increases the silicon yield by predicting the best 3D, multi-planar shape for an IC manufacturing process, leading to lower costs and shorter development times.

Tokenize’s photonic, 3D, multi-planar, integrated circuits (PIC) design and manufacturing architecture, patent application, been granted as U.S. Patent No. 11,862,736 on January 2, 2024. The patent application protects photonic microchip technology, added to Tokenize’s 3D, MP microchip design and manufacturing existing invention. A photonic integrated circuit (PIC), is a device that combines both electronic and photonic components on a small scale. It is designed to process and manipulate light signals instead of electrical signals, enabling faster data transfer and processing compared to traditional electronic microchips. It contains photonic components, which are components that work with light (photons). Tokenize’s patent adds Photonic Technology to the next generation of high performance, bandwidth, and efficiency of PICs, making them a vital part of the high-speed technology of the future. The patent also protects 3D, MP hybrid technology, combining photonics and conventional circuits, offering advantages of photonic circuits working together with conventional ones in a 3D multiplanar structure. Tokenize plans to continue its research in the evolving photonic ICs domain, developing further pioneering advancements and new concepts.