DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments - Seite 2

“At DuPont, we understand the critical role that laminates play in supporting the complex circuits required by our customers. With the launch of Pyralux ML, we're proud to add another innovative solution to our extensive family of laminates,” said Thean Ming Tan, global business director, Laminate Products, DuPont Interconnect Solutions. "Our relentless focus on optimizing thermal management and advanced material performance is driven by the evolving needs of industries such as aerospace, defense, and industrial applications with high-performance, high-reliability requirements. As leaders in materials science and engineering, we're committed to developing new products and applications that push the boundaries of what's possible, and we're honored to be a part of such a vital industry.”

“Heightened demand for robust thermal-management capabilities was the impetus for DuPont to leverage our engineering expertise in creating this unique laminate material, which is not available elsewhere,” stated Richard Wessel, applications technology manager, DuPont Interconnect Solutions. “While fabricators have been assembling laminates using base materials with similar properties, the consistent appearance, strong bond strength, and predictable performance of the Pyralux brand are key benefits for customers that choose Pyralux ML.”

Pyralux ML is just one of the innovative solutions that DuPont is exhibiting at IPC APEX Expo. Other key products to be featured:

• Electroplating chemistries, including copper, nickel, chrome and silver options.
  • One of the newest, Silveron GT-210 Durable Silver, is designed for electrical contact applications requiring high conductivity and can tolerate high temperatures with durability exceeding that of hard gold.
• Full range of Pyralux laminated circuit materials
  • All-polyimide copper-clad flexible laminates (CCLs), including Pyralux HT and Pyralux AP for rigid flex and multilayer flex applications requiring high speed and frequency and reliability
  • Acrylic-based solutions, including Pyralux FR and Pyralux LF CCLs, coverlays, bondplys and sheet adhesives
• Riston advanced dry film photoresists, the industry standard for high yield, productivity, and ease of use in imaging applications
• Interra thin copper-clad laminates, designed for use as embedded-capacitance materials in multilayer rigid PCBs, offer industry-best mechanical strength, reliability and capacitance stability