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     203  0 Kommentare Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the Semiconductor Industry - Seite 3

    Contact:

    Applied Materials:

    Ricky Gradwohl (editorial/media) 408.235.4676
    Michael Sullivan (financial community) 408.986.7977

    Besi:

    Lesen Sie auch

    Richard W. Blickman, President & CEO
    Hetwig van Kerkhof, SVP Finance
    Tel. (31) 26 319 4500
    investor.relations@besi.com



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    Applied Materials and BE Semiconductor Industries to Accelerate Chip Integration Technology for the Semiconductor Industry - Seite 3 Companies Form Joint Program to Develop Industry’s First Complete and Proven Equipment Solution for Die-Based Hybrid BondingSANTA CLARA, Calif. and DUIVEN, the Netherlands, Oct. 22, 2020 (GLOBE NEWSWIRE) - Applied Materials, Inc. and BE …