Taiwan Semiconductor (TSMC) - größter EMS-Player der Welt (Seite 23)

[R-BgO]

Zitat von Raoul777: Moin R-bgo,

vielen Dank für die Info aber auf Onvista.de ist für das Jahr 2013 keine Dividende aufgeführt ?

Stimmt das und wenn nicht, weiss Du zufällig wie hoch die Dividende für das Jahr 2013 ausfällt ?

Wann gibt es eigentlich immer Zahlen und wann wird das Geschäftsjahr abgeschlossen ?

Vielen Dank und Grüsse
Raoul

Vermute, es gibt keine; lt. Dividend History (http://www.tsmc.com/english/investorRelations/dividend_histo…) gab es die letzte Divi Sommer 2013 und der obenstehende Link zum letzten announcement passt dazu.

Meine letzte erhaltene Zahlung passt auch dazu.


Geschäftsjahr ist Kalenderjahr, Zahlen kommen sehr früh meist Ende Januar.

[Raoul777]

Das wird ein Superquartal für Taiwan Semiconductor

Und ich hoffe, dass Apple den A8 Chip für das neue Smartphone
bei Taiwan herstellen lässt. Bin bei 12,85 Euro rein und erfreue mich über der steigenden Kurse.



Quelle:

http://www.reuters.com/article/2014/03/12/tsmc-outlook-idUSL…

TSMC raises Q1 outlook, margin targets on higher chip demand


TAIPEI, March 12 Wed Mar 12, 2014 6:22am EDT

0 Comments




inShare.
Share this



Email
Print
















Related Topics

Stocks »
Markets »
Earnings »
Technology »









(Reuters) - Taiwan Semiconductor Manufacturing Co Ltd, the world's largest contract chipmaker, raised its first-quarter revenue target to T$147 billion ($4.85 billion) due to rising customer demand, Chief Financial Officer Lora Ho said in a statement.

The company had previously set a revenue target of T$136 to T$138 billion.

TSMC also raised its target for gross profit margin to 47 percent from 44.5-46.5 percent, and its operating margin target to 35 percent from 32-34 percent.











TSMC competes with Intel Corp and Samsung Electronics Co Ltd. It had painted a bright outlook for its 2014 business, driven by mobile devices and improved margins from its more advanced chips.

[Raoul777]

Moin R-bgo,

vielen Dank für die Info aber auf Onvista.de ist für das Jahr 2013 keine Dividende aufgeführt ?

Stimmt das und wenn nicht, weiss Du zufällig wie hoch die Dividende für das Jahr 2013 ausfällt ?

Wann gibt es eigentlich immer Zahlen und wann wird das Geschäftsjahr abgeschlossen ?

Vielen Dank und Grüsse
Raoul

[R-BgO]

Antwort auf Beitrag Nr.: 46.482.177 von Raoul777 am 19.02.14 05:40:04

habe Zahlungen bisher in den Monaten Juli & Oktober erhalten;

was sonst willst Du wissen?

Thread & webseite bieten eigentlich bereits sehr viel...

[R-BgO]

http://phys.org/news/2014-03-taiwan-tsmc-chips-iphone.html#n…

[Raoul777]

Hallo zusammen,

hat jemand Erfahrung mit TSM ?
Würde gerne Wissen wann die Dividendenauszahlung ist.
Und auch sonstige Informationen über das Unternehmen würden mich interessieren.
VG

[R-BgO]

TSMC shifts to 8-inch processing to produce fingerprint sensors for next-generation iPhone
Josephine Lien and Mavis Hong, Taipei; Jessie Shen, DIGITIMES [Tuesday 11 February 2014]


Taiwan Semiconductor Manufacturing Company (TSMC) will use its 8-inch processing, instead of 12-inch, to produce fingerprint sensors for Apple's next-generation iPhone due to concerns about yield rates for 12-inch wafer-level packaging (WLP), according to industry sources.

Apple previously decided to have TSMC produce fingerprint sensors for its next-generation iPhone at the foundry's 12-inch facilities using a 65nm process, the sources noted. However, acknowledging risks associated with 12-inch WLP technologies, Apple has finally chosen TSMC's 8-inch processing which enables mature yield rates for WLP to produce the fingerprint sensors, the sources said.

As TSMC shifts back to 8-inch processing to fabricate fingerprint sensors for the next-generation iPhone as done previously, the foundry will continue to subcontract the packaging process to backend houses, the sources indicated. Xintec and China WLCSP are identified as the backend partners.

According to Apple's previous decision, which was to have TSMC fabricate the new fingerprint sensors at its 12-inch fabs, TSMC would handle the backend wafer-level chip-scale packaging (WL-CSP) process in-house, the sources pointed out.

Yield rates for 8-inch WLP are able to exceed 95%, while those for 12-inch WLP at TSMC's facilities at the Southern Taiwan Science Park (STSP) stay between 70% and 80%, the sources revealed.

Fingerprint sensors for Apple's iPhone 5s have been manufactured at TSMC's 8-inch fabs. Produciton of the sensors once suffered unsatisfactory yield rates limiting the availability of the 5s, according to the sources.

[R-BgO]

nachdem ich letztes Jahr über Ausübungen rausgeflogen bin, heute neuer Einstieg:

Verkauf von
short-call Jan15@20$ zu 80c
short-put Jan15@15$ zu 80c
+
Kauf von entsprechender Stückzahl zur Deckung des Call zu $17,91


Ergebnis:
Eingesetztes Kapital je Kontrakt = 1.791+1.500-2*80 = 3.131$

Wenn Kurs in 2015
>20$, dann Erlös = 3.500 => Rendite 11,2%
<15$ dann halte ich 200 Stück zum Einstand von $15,65
oberhalb von 15,65 habe ich positive Rendite

[R-BgO]

TSMC mobile chip sales to grow more than 35% in 2014, says Morris Chang
Jessie Shen, DIGITIMES, Taipei [Friday 17 January 2014]


TSMC's revenues generated from the mobile device sector are expected to increase more than 35% in 2014, buoyed by the rising popularity of smartphones and tablets, and rising silicon content per device, said company chairman Morris Chang at a January 15 investors meeting.

Mobile devices that incorporate 64-bit processors and come with support for multi-mode networks will become widely available in 2014, said Chang. Meanwhile, more devices will include MEMS and NFC, feature new standards in Wi-Fi and Bluetooth, and have fingerprint recognition capabilities. The continued performance improvements and feature enhancements will boost the amount of silicon inside a system, Chang indicated.

Mobile products will be the key growth engine for TSMC in 2014, when the company expects to post double-digit revenue growth, Chang noted. In terms of technology, TSMC's 20nm SoC and 28nm HKMG process nodes will fuel the company's growth in 2014, Chang said.

Also at the investors meeting, TSMC co-CEO CC Wei disclosed that shipments of 20nm process technology will reach about 10% of the company's total wafer sales in 2014. The foundry has moved the node to volume production in the first quarter.

As for TSMC's 16nm FinFET process, the node will be ready for mass production in 2015, company co-CEO Mark Liu indicated.

[R-BgO]

Ergebnisse 2013 kamen am Do;

ein Kommentar dazu: http://www.fool.com/investing/general/2014/01/17/taiwan-semi…