Ich suche das Topinvestment im Nasdaq - 500 Beiträge pro Seite

[Litlleguru]

Hello, Leute.
Ich bin auf der Suche nach dem Topinvestment in Nasdaq.
Bitte postet doch alle eure Top-Tips.
Danke.

[pegeha]

iact.nas

[Schwartenmagen]

Hallo allerseitz,

das absolute Topinvestment an der Nasdaq gesehen auf 1 Jahr ist ganz klar COMMERCE ONE.

Schöne Grüße an alle

Schwartenmagen

[gwohp]

Heisse news und immer noch guenstig bewertet !!!


Trikon Launches Next-Generation PVD Barrier Module

SAN FRANCISCO, Jul 12, 2000 (BUSINESS WIRE) -- Trikon Technologies
(Nasdaq: TRKN) today announced the introduction of an ionised Physical Vapor
Deposition (i-PVD) module that extends the use of all-PVD liner solutions to sub
150 nm design rules.

Trikon, based at Newport, Wales, U.K. is an acknowledged world leader in PVD
liner solutions for W-plug and all-aluminum applications. The introduction of
this latest module is the extension of Trikon`s successful PVD barrier
technologies and follows on from the success of the long-throw family of
Hi-Fill(R) and Ultra(TM) deposition modules. These have significant cost
advantages over competing collimated PVD and CVD barrier technologies.

Ti and TiN are typically used in W-plug applications: Ti to improve contact
resistance at the bottom of contacts and vias, TiN to suppress the natural
tendency for the CVD W precursor to attack exposed Ti and oxide. As devices
shrink, the aspect ratio of contacts and vias rise, limiting the step coverage
of low directionality processes such as conventional PVD.

Deposition of both Ti and TiN by i-PVD offers very high base and sidewall
coverage of liner materials into narrow structures. The ability to use very thin
field layers reduces over-polish at the next CMP metal step, cutting down on
yield-reducing oxide erosion. For advanced via applications, i-PVD Ti/TiN has
demonstrated up to a 20 per cent reduction in via resistance compared to i-PVD
Ti/non-ionised PVD TiN.

"This milestone underlines Trikon`s determination to retain its pole position in
PVD liner technology. Not only does this technology delay the need for costly
CVD solutions for W plug application, but also can be applied to copper barrier
and seed layers in future damascene applications," said Trikon`s vice president
of technology, John Macneil.

In the new barrier deposition system, Ti and TiN are deposited in the same
module, maximizing process flexibility and minimizing cost of ownership. For
contact to silicon and for via applications, Trikon`s i-PVD Ti/TiN offers a
clear alternative to more complicated i-PVD Ti/CVD TiN schemes with the
additional benefit of low resistivity TiN.

The i-PVD module features innovative hardware including an ionizing coil
operating in a net deposition mode ensuring N2 is not re-sputtered during the
next Ti step. This allows the deposition coil to be made out of low-cost
material selected on the basis of cost and manufacturability.

John Macneil commented, "By working closely with our customers, Trikon has
developed an enabling process technology that can provide a substantial
competitive advantage in advanced liner applications. This, combined with
Trikon`s commitment to quality service and support confirms our status as a
global supplier delivering world-class solutions."

[TMRSentinel]

Commerce One - spekulativ aber verdoppelung sehr sehr wahrscheinlich
Dell Computer - sicheres Investment - 30-50% binnen Jahresfrist machbar.
Network Appliance - spekulativ - 30-50 % nochmals drin