200%Chance----Semi Aktie---Turnaround!!!! unter Book Value und Cash! - 500 Beiträge pro Seite
eröffnet am 06.07.03 23:29:32 von
neuester Beitrag 20.07.03 23:18:52 von
neuester Beitrag 20.07.03 23:18:52 von
Beiträge: 16
ID: 750.526
ID: 750.526
Aufrufe heute: 0
Gesamt: 1.066
Gesamt: 1.066
Aktive User: 0
Top-Diskussionen
| Titel | letzter Beitrag | Aufrufe |
|---|---|---|
| heute 07:17 | 870 | |
| 21.05.24, 07:52 | 751 | |
| vor 39 Minuten | 502 | |
| vor 56 Minuten | 462 | |
| vor 1 Stunde | 460 | |
| gestern 00:47 | 399 | |
| gestern 23:18 | 342 | |
| vor 41 Minuten | 339 |
Meistdiskutierte Wertpapiere
| Platz | vorher | Wertpapier | Kurs | Perf. % | Anzahl | ||
|---|---|---|---|---|---|---|---|
| 1. | 5. | 18.717,59 | +0,10 | 80 | |||
| 2. | 1. | 9,6700 | +3,42 | 29 | |||
| 3. | 3. | 54,00 | +13,92 | 29 | |||
| 4. | 2. | 162,14 | -1,88 | 21 | |||
| 5. | 6. | 0,2645 | +10,21 | 20 | |||
| 6. | 8. | 0,2840 | -5,65 | 19 | |||
| 7. | 4. | 1,8150 | +2,54 | 15 | |||
| 8. | 7. | 0,0026 | -72,27 | 13 |
Feedback
wkn 886914
ami kürzel EGLS
kurs aktuell 1,44$
Kurzfristgies Ziel 4,30$!....längerfristig um die 10$!
Book Value (mrq) $4.02
Cash (mrq) $2.30
ami kürzel EGLS
kurs aktuell 1,44$
Kurzfristgies Ziel 4,30$!....längerfristig um die 10$!
Book Value (mrq) $4.02
Cash (mrq) $2.30
haste mal nen Blick auf die Umsaetze und den Gewinn von denen geworfen?
Hilfe!
Hilfe!
http://www.stockconsultant.com/consultnow/basicplus.cgi?symb…
chart ist auch bullish!
@Ariminios
Ich rede von einem Turnaround!
wir werden sehen.....
chart ist auch bullish!
@Ariminios
Ich rede von einem Turnaround!
wir werden sehen.....
Trading Spotlight
Und wieso? Haste da irgendwelche Gruende, nen Turnaround zu vermuten? oder einfach mal so?
@digex
sieht wirklich interessant aus-der chart ist sehr gut!
werde mal morgen position aufbauen.
@Ariminios
Ich kenne x- Werte die genau so aussahen,und sich derdoppelt bis versechsfacht haben,
und der chart läd wirklich zum kauf ein.
Nur meine Meinung
grüße
sieht wirklich interessant aus-der chart ist sehr gut!
werde mal morgen position aufbauen.
@Ariminios
Ich kenne x- Werte die genau so aussahen,und sich derdoppelt bis versechsfacht haben,
und der chart läd wirklich zum kauf ein.
Nur meine Meinung
grüße
Ich auch felici, deswegen bin ich ja so skeptisch. Was nach drei Monaten rally noch uinten liegt, da stimmt vielleicht was nicht.
Ich weiss jetzt nicht genau wie Du das meinst, der chart laed zum Kauf ein:
Sowas hier laed zum Kauf ein:
Sowas hier laed zum Kauf ein:
Bin heute mal eingestiegen zu 1,63$
grüße
grüße
Infineon, TI und Electroglas stellen Tools zur Erkennung von Maskenfehlern vor
June 20, 2003 (2:13 p.m. GMT)
AUSTIN — Moderne Halbleiter-Fotomasken kosten mittlerweile rund eine Million Dollar pro Stück. Der Bedarf an intelligenter Software, die Maskenfehler frühzeitig im Produktionszyklus erkennt, ist daher groß. Zu diesem Schluss kamen jetzt die Teilnehmer eines Seminars des Chiphersteller-Konsortiums International Sematech.
Bei dem in Austin stattfindenden Seminar stellten Electroglas, Infineon, Sematech und Texas Instruments auch neue Yield-Management-Technologien zur Reduzierung von Fehlern schon bei der Fotomasken-Herstellung vor.
"Mit einer besseren Fehlererkennung können wir die Maskenkosten und Lieferzeiten senken", so Kurt Kimmel, Outgoing Mask Program Manager bei Sematech, der auch das Seminar leitete. "Um höhere Erträge zu erzielen, müssen wir die Fehler und deren kritisches Ausmaß in den Griff bekommen. Dafür muss man verstehen, wie die Erträge zustande kommen, wie die Ertragsquellen aussehen und diese Erträge gezielt steuern."
Eine Yield-Management-Software könnte hierfür die Lösung sein. Allerdings fasst diese Technologie nur langsam in der Fotomasken-Branche Fuß. Der Grund liegt auf der Hand: Fotomasken sind heterogene Produkte, die nicht in so großen Mengen produziert werden, als dass sich eine automatische Fehlererkennung rechtfertigen würde.
"Yield-Management-Systeme für Masken gibt es bereits seit einiger Zeit. Allerdings handelte es sich dabei bislang um proprietäre, unternehmensinterne Lösungen, die für bestimmte Anbieter oder Hersteller entwickelt wurden", erklärt Kimmel. "Was fehlt, ist mehr Auswahl bei kommerziellen Systemen, die für Industrie-Standards konfiguriert werden können."
Eine mögliche Software-Lösung könnte ein Produkt mit der Bezeichnung "Yield Mask" sein. Die Software wurde von Infineon und Electroglas entwickelt und bietet vollautomatisierte Ladeprozeduren, inklusive kontinuierlicher Datenerfassung, Error-Trapping, Pre-Process-Funktionen sowie die Speicherung von Daten in einer Datenbank. Außerdem können die Daten über eine benutzerfreundliche GUI ausgewählt und analysiert werden.
Yield Mask kann Scatterplots der gleichen Maske mit Datenüberlagerungen liefern, die aus verschiedenen Inspektionen stammen. Der Anwender kann dann in diesen kombinierten Scatterplots auf einen Fehler klicken und erhält sofort die Bilder, die von diesem Defekt aufgezeichnet wurden. Außerdem kann mit der Software bereits im Voraus abgeschätzt werden, wie sich einer oder mehrere Fehler auf die Maskenqualität auswirken. Auch alle Standard-Analyse-Routinen können in Makros integriert und automatisiert werden.
"Um hohe Erträge zu erhalten und um die Ertragslage weiter zu verbessern, müssen Ertragshindernisse schnell erkannt, begriffen und fortwährend überwacht werden", erklärt Annemarie MacKenzie, Senior Engineer bei Infineon. "Voraussetzung ist, dass der damit verbundene Arbeitsaufwand nicht den finanziellen Vorteil aufwiegt."
Texas Instruments stellte ein Beispiel für einen Management-Ansatz zur Retikel-Fehlerkontrolle vor. Statt jede gelieferte Retikelschablone in seinen modernen Fertigungsanlagen zu überprüfen, verfolgt TI zunehmend eine "neue Philosophie": "Koordinierte Beschaffung" heißt das Zauberwort, mit dem doppelte Inspektionen aus der Welt geschaffen und Produktionsdaten schon früh erfasst werden können.
"Dabei dreht sich alles um die Kosten”, so Tom Smelko, Manager bei TI. "Wir mussten feststellen, dass wir uns die Geräte für Komplett-Inspektionen aller Retikel nicht mehr leisten konnten."
TI arbeitet derzeit an einem automatischen Retikel-Management-System. Dieses soll Inspektionen der meisten Retikel überflüssig machen und bessere Daten von Anbietern erfassen, um Fehler noch vor der Lieferung zu erkennen. Das System soll insbesondere "für den Erfolg ausschlaggebende Daten” für die Retikel erfassen, die von TI gekauft werden. Auch soll das Management diese Daten als Entscheidungsgrundlage verwenden und den Status der Maskenherstellung in den Zuliefererwerken abfragen können. Die Fertigung könnte somit Inspektionsabläufe für Lieferungen kontrollieren und die Geschäftsabläufe sowie andere Funktionen standardisieren.
Fred Lakhani von Sematechs Manufacturing Methods and Productivity Division beschrieb dagegen einen traditionelleren Ansatz. Laut Lakhani verwenden die heutigen Wafer-Fabs eine breite Mischung an Software-Tools, um Fehler und deren Ursachen zu erkennen und den Ausschuss auf ein Minimum zu reduzieren.
Dazu gehören optische und E-Beam-Tools für die Fehlererkennung, die SSA (Spatial Signature Analysis), die ADC (Automatic Defect Classification) und Werkzeuge für die Materialanalyse zur Fehlercharakterisierung. Dazu kommen die Datenanalyse, Data-Mining und elektronische Diagnose-Tools, mit denen die grundlegenden Ursachen von ertragsmindernden Defekten erkannt werden können.
"Die optimale Einbindung dieses riesigen Arsenals an integrierten Yield-Management-Tools und -Technologien erlaubt die schnelle Erkennung der Fehlerquelle und die pünktliche Eliminierung der Grundursache", so Lakhani. "Mit diesen Tools konnten führende Spitzen-Fabs ihre Erträge verbessern - trotz ständig kleinerer Feature-Größen und höherer Chip-Komplexität."
June 20, 2003 (2:13 p.m. GMT)
AUSTIN — Moderne Halbleiter-Fotomasken kosten mittlerweile rund eine Million Dollar pro Stück. Der Bedarf an intelligenter Software, die Maskenfehler frühzeitig im Produktionszyklus erkennt, ist daher groß. Zu diesem Schluss kamen jetzt die Teilnehmer eines Seminars des Chiphersteller-Konsortiums International Sematech.
Bei dem in Austin stattfindenden Seminar stellten Electroglas, Infineon, Sematech und Texas Instruments auch neue Yield-Management-Technologien zur Reduzierung von Fehlern schon bei der Fotomasken-Herstellung vor.
"Mit einer besseren Fehlererkennung können wir die Maskenkosten und Lieferzeiten senken", so Kurt Kimmel, Outgoing Mask Program Manager bei Sematech, der auch das Seminar leitete. "Um höhere Erträge zu erzielen, müssen wir die Fehler und deren kritisches Ausmaß in den Griff bekommen. Dafür muss man verstehen, wie die Erträge zustande kommen, wie die Ertragsquellen aussehen und diese Erträge gezielt steuern."
Eine Yield-Management-Software könnte hierfür die Lösung sein. Allerdings fasst diese Technologie nur langsam in der Fotomasken-Branche Fuß. Der Grund liegt auf der Hand: Fotomasken sind heterogene Produkte, die nicht in so großen Mengen produziert werden, als dass sich eine automatische Fehlererkennung rechtfertigen würde.
"Yield-Management-Systeme für Masken gibt es bereits seit einiger Zeit. Allerdings handelte es sich dabei bislang um proprietäre, unternehmensinterne Lösungen, die für bestimmte Anbieter oder Hersteller entwickelt wurden", erklärt Kimmel. "Was fehlt, ist mehr Auswahl bei kommerziellen Systemen, die für Industrie-Standards konfiguriert werden können."
Eine mögliche Software-Lösung könnte ein Produkt mit der Bezeichnung "Yield Mask" sein. Die Software wurde von Infineon und Electroglas entwickelt und bietet vollautomatisierte Ladeprozeduren, inklusive kontinuierlicher Datenerfassung, Error-Trapping, Pre-Process-Funktionen sowie die Speicherung von Daten in einer Datenbank. Außerdem können die Daten über eine benutzerfreundliche GUI ausgewählt und analysiert werden.
Yield Mask kann Scatterplots der gleichen Maske mit Datenüberlagerungen liefern, die aus verschiedenen Inspektionen stammen. Der Anwender kann dann in diesen kombinierten Scatterplots auf einen Fehler klicken und erhält sofort die Bilder, die von diesem Defekt aufgezeichnet wurden. Außerdem kann mit der Software bereits im Voraus abgeschätzt werden, wie sich einer oder mehrere Fehler auf die Maskenqualität auswirken. Auch alle Standard-Analyse-Routinen können in Makros integriert und automatisiert werden.
"Um hohe Erträge zu erhalten und um die Ertragslage weiter zu verbessern, müssen Ertragshindernisse schnell erkannt, begriffen und fortwährend überwacht werden", erklärt Annemarie MacKenzie, Senior Engineer bei Infineon. "Voraussetzung ist, dass der damit verbundene Arbeitsaufwand nicht den finanziellen Vorteil aufwiegt."
Texas Instruments stellte ein Beispiel für einen Management-Ansatz zur Retikel-Fehlerkontrolle vor. Statt jede gelieferte Retikelschablone in seinen modernen Fertigungsanlagen zu überprüfen, verfolgt TI zunehmend eine "neue Philosophie": "Koordinierte Beschaffung" heißt das Zauberwort, mit dem doppelte Inspektionen aus der Welt geschaffen und Produktionsdaten schon früh erfasst werden können.
"Dabei dreht sich alles um die Kosten”, so Tom Smelko, Manager bei TI. "Wir mussten feststellen, dass wir uns die Geräte für Komplett-Inspektionen aller Retikel nicht mehr leisten konnten."
TI arbeitet derzeit an einem automatischen Retikel-Management-System. Dieses soll Inspektionen der meisten Retikel überflüssig machen und bessere Daten von Anbietern erfassen, um Fehler noch vor der Lieferung zu erkennen. Das System soll insbesondere "für den Erfolg ausschlaggebende Daten” für die Retikel erfassen, die von TI gekauft werden. Auch soll das Management diese Daten als Entscheidungsgrundlage verwenden und den Status der Maskenherstellung in den Zuliefererwerken abfragen können. Die Fertigung könnte somit Inspektionsabläufe für Lieferungen kontrollieren und die Geschäftsabläufe sowie andere Funktionen standardisieren.
Fred Lakhani von Sematechs Manufacturing Methods and Productivity Division beschrieb dagegen einen traditionelleren Ansatz. Laut Lakhani verwenden die heutigen Wafer-Fabs eine breite Mischung an Software-Tools, um Fehler und deren Ursachen zu erkennen und den Ausschuss auf ein Minimum zu reduzieren.
Dazu gehören optische und E-Beam-Tools für die Fehlererkennung, die SSA (Spatial Signature Analysis), die ADC (Automatic Defect Classification) und Werkzeuge für die Materialanalyse zur Fehlercharakterisierung. Dazu kommen die Datenanalyse, Data-Mining und elektronische Diagnose-Tools, mit denen die grundlegenden Ursachen von ertragsmindernden Defekten erkannt werden können.
"Die optimale Einbindung dieses riesigen Arsenals an integrierten Yield-Management-Tools und -Technologien erlaubt die schnelle Erkennung der Fehlerquelle und die pünktliche Eliminierung der Grundursache", so Lakhani. "Mit diesen Tools konnten führende Spitzen-Fabs ihre Erträge verbessern - trotz ständig kleinerer Feature-Größen und höherer Chip-Komplexität."
electroglas sieht megabullish aus!!!!
kurzfristiges ziel 5$.....längesfristig 10$
Electroglas Sells Front-End Software Product Lines to FEI Company, Reaffirms and Narrows Financial Guidance for 2nd Quarter
Tuesday July 15, 9:11 am ET
SAN JOSE, Calif.--(BUSINESS WIRE)--July 15, 2003--Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probing and test handling solutions for the semiconductor industry, today announced that it has sold its Design for Manufacturing (DFM) and Fab Solutions software product lines to FEI Company (Nasdaq:FEIC - News) for $6 million in cash plus the assumption of certain liabilities. The product lines, including Electroglas` Yield Manager and Merlin`s Framework products, will form the foundation of a new FEI division that will be staffed, in part, by existing Electroglas` DFM and Fab Solutions employees.
ADVERTISEMENT
"Earlier this year, we set out to narrow our focus, concentrating on delivering advanced wafer probers and extending our wafer probing technologies to drive equipment and process efficiencies throughout the back-end," said Curt Wozniak, chairman and CEO of Electroglas. "The sale of these product lines reaffirms that focus, allowing us to spend more time developing and delivering innovative products, such as our recently launched NETprobing technology and Sidewinder strip test handler, helping customers to overcome their most critical manufacturing challenges."
As part of the purchase, FEI will assume control of Electroglas` DFM and Fab Solutions engineering operations in Mumbai, India. Electroglas will work closely with FEI to provide a seamless transition and a continued high level of support for customers who are currently using the DFM and Fab Solutions products.
"We are very excited about the strategic value of this acquisition. It is a key element of our growth and design to yield focus," said Vahe` Sarkissian, chairman, president and CEO of FEI. "Electroglas` highly popular Merlin`s Framework(TM) CAD navigation software will greatly enhance FEI`s suite of solutions for circuit edit and support our design to yield strategy."
Updating financial guidance delivered as part of its Q1 financial release, Electroglas expects revenues for its second fiscal quarter, ended June 28th, 2003, to be in the range of $10 million to $11 million. In addition, in the Q1 financial release Electroglas announced the intended sale of its optical wafer inspection operations. This sale was not completed as expected and Electroglas has discontinued further development of wafer inspection products. Electroglas will continue to support existing inspection customers.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
About FEI
FEI is a nanotechnology company providing enabling 3D Structural Process Management(TM) solutions to the world`s technology leaders in the fields of semiconductors, data storage, structural biology and industry. Its range of industry-leading DualBeam(TM) and single column focused ion and electron beam products enables manufacturers and researchers to keep pace with technology shifts and develop next generation technologies and products. FEI`s products allow advanced three-dimensional metrology, device editing, trimming, and structural analysis for management of sub-micron structures including those found in integrated circuits, high-density magnetic storage devices, industrial materials, chemical compounds, and biological structures. FEI solutions deliver enhanced production yields, lower costs and faster time to market-critical benefits in highly competitive markets. Headquartered in Hillsboro, Oregon, FEI has approximately 1,600 employees worldwide, with additional development and manufacturing operations located in Peabody, Massachusetts; Sunnyvale, California; Eindhoven, The Netherlands; and Brno, Czech Republic. More information can be found on the FEI website at: www.feicompany.com.
Legal Notice Regarding Forward-Looking Statements
This press release contains forward-looking statements including statements relating to (a) the assumption of operations by FEI and a seamless transition and continued high level of support for customers who are currently using the DFM and Fab Solutions products and (b) our expectations regarding second quarter revenues. These forward-looking statements involve risks and uncertainties including, but not limited to the risk that we are unable to recognize revenue in the anticipated quarter and that current order estimates are not realized. We assume no obligation to update this information. For a further discussion of risks and uncertainties that could cause actual results to differ from those expressed in these forward-looking statements, as well as risks relating to Electroglas` business in general, see the risk disclosures in Electroglas` SEC filings, including its most recent Annual Report on Form 10-K for the year ended December 31, 2002 and its quarterly reports on Form 10-Q filed from time to time with the SEC.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167
Marketing Communications Manager
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
Director
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas, Inc.
kurzfristiges ziel 5$.....längesfristig 10$
Electroglas Sells Front-End Software Product Lines to FEI Company, Reaffirms and Narrows Financial Guidance for 2nd Quarter
Tuesday July 15, 9:11 am ET
SAN JOSE, Calif.--(BUSINESS WIRE)--July 15, 2003--Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probing and test handling solutions for the semiconductor industry, today announced that it has sold its Design for Manufacturing (DFM) and Fab Solutions software product lines to FEI Company (Nasdaq:FEIC - News) for $6 million in cash plus the assumption of certain liabilities. The product lines, including Electroglas` Yield Manager and Merlin`s Framework products, will form the foundation of a new FEI division that will be staffed, in part, by existing Electroglas` DFM and Fab Solutions employees.
ADVERTISEMENT
"Earlier this year, we set out to narrow our focus, concentrating on delivering advanced wafer probers and extending our wafer probing technologies to drive equipment and process efficiencies throughout the back-end," said Curt Wozniak, chairman and CEO of Electroglas. "The sale of these product lines reaffirms that focus, allowing us to spend more time developing and delivering innovative products, such as our recently launched NETprobing technology and Sidewinder strip test handler, helping customers to overcome their most critical manufacturing challenges."
As part of the purchase, FEI will assume control of Electroglas` DFM and Fab Solutions engineering operations in Mumbai, India. Electroglas will work closely with FEI to provide a seamless transition and a continued high level of support for customers who are currently using the DFM and Fab Solutions products.
"We are very excited about the strategic value of this acquisition. It is a key element of our growth and design to yield focus," said Vahe` Sarkissian, chairman, president and CEO of FEI. "Electroglas` highly popular Merlin`s Framework(TM) CAD navigation software will greatly enhance FEI`s suite of solutions for circuit edit and support our design to yield strategy."
Updating financial guidance delivered as part of its Q1 financial release, Electroglas expects revenues for its second fiscal quarter, ended June 28th, 2003, to be in the range of $10 million to $11 million. In addition, in the Q1 financial release Electroglas announced the intended sale of its optical wafer inspection operations. This sale was not completed as expected and Electroglas has discontinued further development of wafer inspection products. Electroglas will continue to support existing inspection customers.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
About FEI
FEI is a nanotechnology company providing enabling 3D Structural Process Management(TM) solutions to the world`s technology leaders in the fields of semiconductors, data storage, structural biology and industry. Its range of industry-leading DualBeam(TM) and single column focused ion and electron beam products enables manufacturers and researchers to keep pace with technology shifts and develop next generation technologies and products. FEI`s products allow advanced three-dimensional metrology, device editing, trimming, and structural analysis for management of sub-micron structures including those found in integrated circuits, high-density magnetic storage devices, industrial materials, chemical compounds, and biological structures. FEI solutions deliver enhanced production yields, lower costs and faster time to market-critical benefits in highly competitive markets. Headquartered in Hillsboro, Oregon, FEI has approximately 1,600 employees worldwide, with additional development and manufacturing operations located in Peabody, Massachusetts; Sunnyvale, California; Eindhoven, The Netherlands; and Brno, Czech Republic. More information can be found on the FEI website at: www.feicompany.com.
Legal Notice Regarding Forward-Looking Statements
This press release contains forward-looking statements including statements relating to (a) the assumption of operations by FEI and a seamless transition and continued high level of support for customers who are currently using the DFM and Fab Solutions products and (b) our expectations regarding second quarter revenues. These forward-looking statements involve risks and uncertainties including, but not limited to the risk that we are unable to recognize revenue in the anticipated quarter and that current order estimates are not realized. We assume no obligation to update this information. For a further discussion of risks and uncertainties that could cause actual results to differ from those expressed in these forward-looking statements, as well as risks relating to Electroglas` business in general, see the risk disclosures in Electroglas` SEC filings, including its most recent Annual Report on Form 10-K for the year ended December 31, 2002 and its quarterly reports on Form 10-Q filed from time to time with the SEC.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167
Marketing Communications Manager
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
Director
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas, Inc.
Electroglas Unveils NETprobing Technology
Monday July 14, 8:35 am ET
Company`s Innovative Prober Technology Helps Chipmakers Attain Faster Answers to Critical Manufacturing Questions
SAN JOSE, Calif.--(BUSINESS WIRE)--July 14, 2003--Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probers and prober-based test handling solutions for the semiconductor industry, today announced the introduction of its new NETprobing technology, delivering a networked system of "smart" probers that improve overall test floor efficiency through remote monitoring and control, as well as automated data collection, analysis and reporting. This advanced functionality, dispersed across a sort floor, can help chipmakers get faster answers to critical questions about device quality, manufacturing performance and corrective action needed.
"Electroglas has been on the leading edge of advanced wafer probing technologies for the more than 30 years, taking the industry from manual to semi-automatic, and then on to fully automatic wafer probers. Now we are launching the next major evolution in probing -- NETprobing," said Curt Wozniak, chairman and CEO at Electroglas. "NETprobing gives chipmakers the insight and control they need to improve sort floor efficiency and drive down test costs. I believe this capability will become a requirement set by manufacturers as they adopt 300mm technology. It truly is a smarter way to probe."
NETprobing technology allows sort floor managers to view the status of and take control over any wafer prober, anywhere in the world, right from their desktops. Yield and bin information can be tracked, machine status monitored, live video images viewed and probing recipes changed, all from a web-based user interface.
The Sort Event Manager module allows for automatic e-mail or pager notification of any excursions or anomalies in either the device test results or machine characteristics, and built-in statistical process control functionality allows for automatic control over many aspects of the wafer probing process. The system also provides for centralized management and storage of prober recipes and wafer maps.
As part of Electroglas` focus on delivering advanced, prober-based technologies that enable smarter manufacturing, all Electroglas probers can incorporate NETprobing technology. Electroglas will also provide the technical support necessary to integrate NETprobing into existing test operations, and offer a NETprobing upgrade for current Electroglas customers who wish to extend the capabilities of their Electroglas probers.
NETprobing technology will be demonstrated on the latest model of Electroglas` flagship 300mm prober -- the EG5/300 NETprober -- in booth #10718 in McEnery Hall during the Final Manufacturing portion of SEMICON West 2003, being held July 16-18 at the San Jose Convention Center. More information on NETprobing technology and the EG5/300 NETprober, is also available by contacting Electroglas at 408/528-3000 or visiting www.electroglas.com.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, Calif., the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167
Communications Manager
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
Director Marketing
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas, Inc.
Monday July 14, 8:35 am ET
Company`s Innovative Prober Technology Helps Chipmakers Attain Faster Answers to Critical Manufacturing Questions
SAN JOSE, Calif.--(BUSINESS WIRE)--July 14, 2003--Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probers and prober-based test handling solutions for the semiconductor industry, today announced the introduction of its new NETprobing technology, delivering a networked system of "smart" probers that improve overall test floor efficiency through remote monitoring and control, as well as automated data collection, analysis and reporting. This advanced functionality, dispersed across a sort floor, can help chipmakers get faster answers to critical questions about device quality, manufacturing performance and corrective action needed.
"Electroglas has been on the leading edge of advanced wafer probing technologies for the more than 30 years, taking the industry from manual to semi-automatic, and then on to fully automatic wafer probers. Now we are launching the next major evolution in probing -- NETprobing," said Curt Wozniak, chairman and CEO at Electroglas. "NETprobing gives chipmakers the insight and control they need to improve sort floor efficiency and drive down test costs. I believe this capability will become a requirement set by manufacturers as they adopt 300mm technology. It truly is a smarter way to probe."
NETprobing technology allows sort floor managers to view the status of and take control over any wafer prober, anywhere in the world, right from their desktops. Yield and bin information can be tracked, machine status monitored, live video images viewed and probing recipes changed, all from a web-based user interface.
The Sort Event Manager module allows for automatic e-mail or pager notification of any excursions or anomalies in either the device test results or machine characteristics, and built-in statistical process control functionality allows for automatic control over many aspects of the wafer probing process. The system also provides for centralized management and storage of prober recipes and wafer maps.
As part of Electroglas` focus on delivering advanced, prober-based technologies that enable smarter manufacturing, all Electroglas probers can incorporate NETprobing technology. Electroglas will also provide the technical support necessary to integrate NETprobing into existing test operations, and offer a NETprobing upgrade for current Electroglas customers who wish to extend the capabilities of their Electroglas probers.
NETprobing technology will be demonstrated on the latest model of Electroglas` flagship 300mm prober -- the EG5/300 NETprober -- in booth #10718 in McEnery Hall during the Final Manufacturing portion of SEMICON West 2003, being held July 16-18 at the San Jose Convention Center. More information on NETprobing technology and the EG5/300 NETprober, is also available by contacting Electroglas at 408/528-3000 or visiting www.electroglas.com.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, Calif., the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167
Communications Manager
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
Director Marketing
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas, Inc.
Electroglas Names Former Tokyo Electron Executive as Vice President of Sales
Tuesday July 15, 8:31 am ET
Industry Veteran to Spearhead Sales Efforts as Electroglas Introduces New NETprober Technology and Test Handling System
SAN JOSE, Calif.--(BUSINESS WIRE)--July 15, 2003-- Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probing and test handling solutions for the semiconductor industry, today announced that Patrick Kiely, industry veteran and former Tokyo Electron Limited (TEL) executive, has joined Electroglas as vice president of worldwide sales and service. An experienced sales, service and marketing expert, Mr. Kiely will lead Electroglas sales and customer support efforts as the company launches innovative new systems and software, based on its proven prober technologies.
"Not only is Mr. Kiely a highly qualified leader who has repeatedly proven his ability to increase revenues, but he is an individual that is recognized and respected throughout the semiconductor industry," said Curt Wozniak, Chairman and CEO of Electroglas. "His track record, combined with the innovative new technologies our team has been working on over the past several years, should serve us well as we address current and prospective customers` pressing manufacturing questions, helping deliver faster answers with our probers, test handlers and test automation software."
Most recently, Mr. Kiely served as director of test systems operations at TEL, where he managed sales, service, marketing, and engineering functions for the wafer prober business unit, among others, with revenue between $40-80 million. Formerly the director of sales for KLA Instruments` ATS Division, where he was responsible for sales of automatic wafer probers and led a staff that set records for sales and backlogs, Mr. Kiely has a history of successfully implementing strategies and managing teams that increased sales for his company.
In addition to his stints at KLA and TEL, Mr. Kiely has worked for Watkins Johnson, as the manager for strategic accounts. Mr. Kiely`s career in technology began at Digital Equipment, which he joined after serving for three years in the US Marine Corps. He holds a Bachelor of Arts degree from Rutgers University.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167 (Corporate)
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas
Tuesday July 15, 8:31 am ET
Industry Veteran to Spearhead Sales Efforts as Electroglas Introduces New NETprober Technology and Test Handling System
SAN JOSE, Calif.--(BUSINESS WIRE)--July 15, 2003-- Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probing and test handling solutions for the semiconductor industry, today announced that Patrick Kiely, industry veteran and former Tokyo Electron Limited (TEL) executive, has joined Electroglas as vice president of worldwide sales and service. An experienced sales, service and marketing expert, Mr. Kiely will lead Electroglas sales and customer support efforts as the company launches innovative new systems and software, based on its proven prober technologies.
"Not only is Mr. Kiely a highly qualified leader who has repeatedly proven his ability to increase revenues, but he is an individual that is recognized and respected throughout the semiconductor industry," said Curt Wozniak, Chairman and CEO of Electroglas. "His track record, combined with the innovative new technologies our team has been working on over the past several years, should serve us well as we address current and prospective customers` pressing manufacturing questions, helping deliver faster answers with our probers, test handlers and test automation software."
Most recently, Mr. Kiely served as director of test systems operations at TEL, where he managed sales, service, marketing, and engineering functions for the wafer prober business unit, among others, with revenue between $40-80 million. Formerly the director of sales for KLA Instruments` ATS Division, where he was responsible for sales of automatic wafer probers and led a staff that set records for sales and backlogs, Mr. Kiely has a history of successfully implementing strategies and managing teams that increased sales for his company.
In addition to his stints at KLA and TEL, Mr. Kiely has worked for Watkins Johnson, as the manager for strategic accounts. Mr. Kiely`s career in technology began at Digital Equipment, which he joined after serving for three years in the US Marine Corps. He holds a Bachelor of Arts degree from Rutgers University.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167 (Corporate)
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas
Electroglas Sells Front-End Software Product Lines to FEI Company, Reaffirms and Narrows Financial Guidance for 2nd Quarter
Tuesday July 15, 9:11 am ET
SAN JOSE, Calif.--(BUSINESS WIRE)--July 15, 2003--Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probing and test handling solutions for the semiconductor industry, today announced that it has sold its Design for Manufacturing (DFM) and Fab Solutions software product lines to FEI Company (Nasdaq:FEIC - News) for $6 million in cash plus the assumption of certain liabilities. The product lines, including Electroglas` Yield Manager and Merlin`s Framework products, will form the foundation of a new FEI division that will be staffed, in part, by existing Electroglas` DFM and Fab Solutions employees.
ADVERTISEMENT
"Earlier this year, we set out to narrow our focus, concentrating on delivering advanced wafer probers and extending our wafer probing technologies to drive equipment and process efficiencies throughout the back-end," said Curt Wozniak, chairman and CEO of Electroglas. "The sale of these product lines reaffirms that focus, allowing us to spend more time developing and delivering innovative products, such as our recently launched NETprobing technology and Sidewinder strip test handler, helping customers to overcome their most critical manufacturing challenges."
As part of the purchase, FEI will assume control of Electroglas` DFM and Fab Solutions engineering operations in Mumbai, India. Electroglas will work closely with FEI to provide a seamless transition and a continued high level of support for customers who are currently using the DFM and Fab Solutions products.
"We are very excited about the strategic value of this acquisition. It is a key element of our growth and design to yield focus," said Vahe` Sarkissian, chairman, president and CEO of FEI. "Electroglas` highly popular Merlin`s Framework(TM) CAD navigation software will greatly enhance FEI`s suite of solutions for circuit edit and support our design to yield strategy."
Updating financial guidance delivered as part of its Q1 financial release, Electroglas expects revenues for its second fiscal quarter, ended June 28th, 2003, to be in the range of $10 million to $11 million. In addition, in the Q1 financial release Electroglas announced the intended sale of its optical wafer inspection operations. This sale was not completed as expected and Electroglas has discontinued further development of wafer inspection products. Electroglas will continue to support existing inspection customers.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
About FEI
FEI is a nanotechnology company providing enabling 3D Structural Process Management(TM) solutions to the world`s technology leaders in the fields of semiconductors, data storage, structural biology and industry. Its range of industry-leading DualBeam(TM) and single column focused ion and electron beam products enables manufacturers and researchers to keep pace with technology shifts and develop next generation technologies and products. FEI`s products allow advanced three-dimensional metrology, device editing, trimming, and structural analysis for management of sub-micron structures including those found in integrated circuits, high-density magnetic storage devices, industrial materials, chemical compounds, and biological structures. FEI solutions deliver enhanced production yields, lower costs and faster time to market-critical benefits in highly competitive markets. Headquartered in Hillsboro, Oregon, FEI has approximately 1,600 employees worldwide, with additional development and manufacturing operations located in Peabody, Massachusetts; Sunnyvale, California; Eindhoven, The Netherlands; and Brno, Czech Republic. More information can be found on the FEI website at: www.feicompany.com.
Legal Notice Regarding Forward-Looking Statements
This press release contains forward-looking statements including statements relating to (a) the assumption of operations by FEI and a seamless transition and continued high level of support for customers who are currently using the DFM and Fab Solutions products and (b) our expectations regarding second quarter revenues. These forward-looking statements involve risks and uncertainties including, but not limited to the risk that we are unable to recognize revenue in the anticipated quarter and that current order estimates are not realized. We assume no obligation to update this information. For a further discussion of risks and uncertainties that could cause actual results to differ from those expressed in these forward-looking statements, as well as risks relating to Electroglas` business in general, see the risk disclosures in Electroglas` SEC filings, including its most recent Annual Report on Form 10-K for the year ended December 31, 2002 and its quarterly reports on Form 10-Q filed from time to time with the SEC.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167
Marketing Communications Manager
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
Director
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas, Inc.
Tuesday July 15, 9:11 am ET
SAN JOSE, Calif.--(BUSINESS WIRE)--July 15, 2003--Electroglas, Inc. (Nasdaq:EGLS - News), a leading supplier of wafer probing and test handling solutions for the semiconductor industry, today announced that it has sold its Design for Manufacturing (DFM) and Fab Solutions software product lines to FEI Company (Nasdaq:FEIC - News) for $6 million in cash plus the assumption of certain liabilities. The product lines, including Electroglas` Yield Manager and Merlin`s Framework products, will form the foundation of a new FEI division that will be staffed, in part, by existing Electroglas` DFM and Fab Solutions employees.
ADVERTISEMENT
"Earlier this year, we set out to narrow our focus, concentrating on delivering advanced wafer probers and extending our wafer probing technologies to drive equipment and process efficiencies throughout the back-end," said Curt Wozniak, chairman and CEO of Electroglas. "The sale of these product lines reaffirms that focus, allowing us to spend more time developing and delivering innovative products, such as our recently launched NETprobing technology and Sidewinder strip test handler, helping customers to overcome their most critical manufacturing challenges."
As part of the purchase, FEI will assume control of Electroglas` DFM and Fab Solutions engineering operations in Mumbai, India. Electroglas will work closely with FEI to provide a seamless transition and a continued high level of support for customers who are currently using the DFM and Fab Solutions products.
"We are very excited about the strategic value of this acquisition. It is a key element of our growth and design to yield focus," said Vahe` Sarkissian, chairman, president and CEO of FEI. "Electroglas` highly popular Merlin`s Framework(TM) CAD navigation software will greatly enhance FEI`s suite of solutions for circuit edit and support our design to yield strategy."
Updating financial guidance delivered as part of its Q1 financial release, Electroglas expects revenues for its second fiscal quarter, ended June 28th, 2003, to be in the range of $10 million to $11 million. In addition, in the Q1 financial release Electroglas announced the intended sale of its optical wafer inspection operations. This sale was not completed as expected and Electroglas has discontinued further development of wafer inspection products. Electroglas will continue to support existing inspection customers.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment supplier to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
About FEI
FEI is a nanotechnology company providing enabling 3D Structural Process Management(TM) solutions to the world`s technology leaders in the fields of semiconductors, data storage, structural biology and industry. Its range of industry-leading DualBeam(TM) and single column focused ion and electron beam products enables manufacturers and researchers to keep pace with technology shifts and develop next generation technologies and products. FEI`s products allow advanced three-dimensional metrology, device editing, trimming, and structural analysis for management of sub-micron structures including those found in integrated circuits, high-density magnetic storage devices, industrial materials, chemical compounds, and biological structures. FEI solutions deliver enhanced production yields, lower costs and faster time to market-critical benefits in highly competitive markets. Headquartered in Hillsboro, Oregon, FEI has approximately 1,600 employees worldwide, with additional development and manufacturing operations located in Peabody, Massachusetts; Sunnyvale, California; Eindhoven, The Netherlands; and Brno, Czech Republic. More information can be found on the FEI website at: www.feicompany.com.
Legal Notice Regarding Forward-Looking Statements
This press release contains forward-looking statements including statements relating to (a) the assumption of operations by FEI and a seamless transition and continued high level of support for customers who are currently using the DFM and Fab Solutions products and (b) our expectations regarding second quarter revenues. These forward-looking statements involve risks and uncertainties including, but not limited to the risk that we are unable to recognize revenue in the anticipated quarter and that current order estimates are not realized. We assume no obligation to update this information. For a further discussion of risks and uncertainties that could cause actual results to differ from those expressed in these forward-looking statements, as well as risks relating to Electroglas` business in general, see the risk disclosures in Electroglas` SEC filings, including its most recent Annual Report on Form 10-K for the year ended December 31, 2002 and its quarterly reports on Form 10-Q filed from time to time with the SEC.
--------------------------------------------------------------------------------
Contact:
Electroglas, Inc.
Cristie Lynch, 408/528-3167
Marketing Communications Manager
clynch@electroglas.com
or
Loomis Group
Jennifer Anselmo, 415/882-9494 (Media)
Director
anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: Electroglas, Inc.
KINESYS Software, Electroglas and Intercon Technology Form Partnership to Automate Strip Processing in the Test Assembly Area
Wednesday July 16, 9:00 am ET
Major Equipment Manufacturers Collaborate on Integration of Assembly Line Production Supervisor (ALPS)
SAN JOSE, CA--(MARKET WIRE)--Jul 16, 2003 -- SEMICON West -- KINESYS Software, Inc., a leading provider of software for the automation of semiconductor manufacturing processes, announced today that it has entered into separate agreements with two major equipment suppliers to collaborate on the development of non-proprietary solutions for the automation of semiconductor final manufacturing processes. The suppliers are Intercon Technology, Inc., a United States subsidiary of TOWA Corporation of Kyoto, Japan, and Electroglas, Inc. of San Jose.
KINESYS Software is the provider of the world`s leading non-proprietary wafer mapping/equipment integration software for inkless assembly. The company`s flagship Assembly Line Production Supervisor (ALPS) product line extends wafer mapping capability to strip and tray maps, and the equipment interface has been extended to allow many different types of equipment to be connected, e.g. bump inspection, wafer probe, flip chip, mold, strip test, laser mark and singulation.
"Intercon Technology and Electroglas are important additions to a growing list of worldwide suppliers of assembly equipment that have integrated ALPS compatibility into their product line," said Dave Huntley, president, KINESYS Software. "The synergy of our combined expertise will enable us to integrate semiconductor assembly from wafer probe/sort through to the singulated device, providing process control solutions for a wide variety of equipment that will both reduce costs and afford manufacturers the data necessary to track flawed components through the assembly process right back to the wafer."
Intercon Technology will work with KINESYS Software on the integration of augmented mapping and tracking capability into their singulation equipment. Intercon Technology is the American subsidiary of TOWA Corporation responsible for the design and manufacture of singulation systems. TOWA Corporation is the world`s largest supplier of auto-molding process technology and equipment.
"This arrangement between three companies, that have in common a long-standing history of developing successful automation solutions for assembly and test, emphasizes the growing importance of strip handling and testing," said Kim Tan, President, Intercon Technology. "Together KINESYS, Electroglas and Intercon form a formidable team, united by a common goal of bringing process control solutions to the entire integrated packaging assembly line."
Electroglas, Inc. will likewise collaborate with KINESYS Software on the integration of strip testing into assembly. Electroglas recently announced its advanced prober based strip test handler -- Sidewinder. Sidewinder`s unique combination of high-speed handling and machine vision, based upon the company`s proven prober technology, allows unprecedented accuracy and throughput in a strip test cell.
"Our goal at Electroglas is to provide fast, innovative answers to our customers` pressing manufacturing questions, and collaborating with experienced partners such as Intercon and KINESYS helps us accomplish this mission," said Bob Fenton, director of marketing, Electroglas, Inc. "Our combined products form a well integrated solution for strip processing that offers significant performance gains for customers, and we look forward to demonstrating that at SEMICON West."
ALPS will be demonstrated at SEMICON West 2003 (Final Manufacturing) in San Jose July 16-18 at both the Electroglas booth (# 10718) and the TOWA/Intercon booth (# 10142) in McEnery Hall at the San Jose Convention Center.
Companies interested in participating in beta testing the new ALPS features may contact KINESYS Software, Inc.
About KINESYS Software, Inc.
Founded in 1992, KINESYS Software is a privately held company based in Utrecht, The Netherlands, and having a United States office in Petaluma, CA. The company is focused on the automation of semiconductor final manufacturing (test, assembly and packaging) processes. In particular, it offers innovative software products and expert support services for inkless assembly and equipment integration. For more information on the company, visit the web site, www.kinesysinc.com, or call Henk Barreveld in the Netherlands at +31 (30) 233 2331, or Dave Huntley in the US office +1 (707) 766-8855.
About Intercon Technology, Inc.
Founded in 1986, Intercon Technology`s core business is centered on delivering semiconductor capital equipment for singulation in final manufacturing of semiconductor devices. Intercon excels in identifying market opportunities then applying our technology to provide the market with industry leading products and services. Intercon holds patents in singulation and continues to differentiate technology by developing and integrating innovative solutions to new packaging challenges. More information about the company and its products is available at www.intercontechnology.com.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment provider to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
Contact:
Contact: Chris Cook
Company: Fourth Estate Public Relations Network
Voice: 510-595-6836
Email: ccook@fourthestatepr.com
Contact: Dave Huntley
Company: KINESYS Software, Inc.
Voice: 707-766-8855
Contact: Chris Winkler
Company: Intercon Technology, Inc.
Voice: 408-778-5992
Email: cwinkler@intercontechnology.com
Contact: Cristie Lynch
Company: Electroglas, Inc.
Voice: 408-528-3167
Email: clynch@electroglas.com
Contact: Jennifer Anselmo
Company: Loomis Group
Voice: 415-882-9494
Email: anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: KINESYS Software, Inc.
Wednesday July 16, 9:00 am ET
Major Equipment Manufacturers Collaborate on Integration of Assembly Line Production Supervisor (ALPS)
SAN JOSE, CA--(MARKET WIRE)--Jul 16, 2003 -- SEMICON West -- KINESYS Software, Inc., a leading provider of software for the automation of semiconductor manufacturing processes, announced today that it has entered into separate agreements with two major equipment suppliers to collaborate on the development of non-proprietary solutions for the automation of semiconductor final manufacturing processes. The suppliers are Intercon Technology, Inc., a United States subsidiary of TOWA Corporation of Kyoto, Japan, and Electroglas, Inc. of San Jose.
KINESYS Software is the provider of the world`s leading non-proprietary wafer mapping/equipment integration software for inkless assembly. The company`s flagship Assembly Line Production Supervisor (ALPS) product line extends wafer mapping capability to strip and tray maps, and the equipment interface has been extended to allow many different types of equipment to be connected, e.g. bump inspection, wafer probe, flip chip, mold, strip test, laser mark and singulation.
"Intercon Technology and Electroglas are important additions to a growing list of worldwide suppliers of assembly equipment that have integrated ALPS compatibility into their product line," said Dave Huntley, president, KINESYS Software. "The synergy of our combined expertise will enable us to integrate semiconductor assembly from wafer probe/sort through to the singulated device, providing process control solutions for a wide variety of equipment that will both reduce costs and afford manufacturers the data necessary to track flawed components through the assembly process right back to the wafer."
Intercon Technology will work with KINESYS Software on the integration of augmented mapping and tracking capability into their singulation equipment. Intercon Technology is the American subsidiary of TOWA Corporation responsible for the design and manufacture of singulation systems. TOWA Corporation is the world`s largest supplier of auto-molding process technology and equipment.
"This arrangement between three companies, that have in common a long-standing history of developing successful automation solutions for assembly and test, emphasizes the growing importance of strip handling and testing," said Kim Tan, President, Intercon Technology. "Together KINESYS, Electroglas and Intercon form a formidable team, united by a common goal of bringing process control solutions to the entire integrated packaging assembly line."
Electroglas, Inc. will likewise collaborate with KINESYS Software on the integration of strip testing into assembly. Electroglas recently announced its advanced prober based strip test handler -- Sidewinder. Sidewinder`s unique combination of high-speed handling and machine vision, based upon the company`s proven prober technology, allows unprecedented accuracy and throughput in a strip test cell.
"Our goal at Electroglas is to provide fast, innovative answers to our customers` pressing manufacturing questions, and collaborating with experienced partners such as Intercon and KINESYS helps us accomplish this mission," said Bob Fenton, director of marketing, Electroglas, Inc. "Our combined products form a well integrated solution for strip processing that offers significant performance gains for customers, and we look forward to demonstrating that at SEMICON West."
ALPS will be demonstrated at SEMICON West 2003 (Final Manufacturing) in San Jose July 16-18 at both the Electroglas booth (# 10718) and the TOWA/Intercon booth (# 10142) in McEnery Hall at the San Jose Convention Center.
Companies interested in participating in beta testing the new ALPS features may contact KINESYS Software, Inc.
About KINESYS Software, Inc.
Founded in 1992, KINESYS Software is a privately held company based in Utrecht, The Netherlands, and having a United States office in Petaluma, CA. The company is focused on the automation of semiconductor final manufacturing (test, assembly and packaging) processes. In particular, it offers innovative software products and expert support services for inkless assembly and equipment integration. For more information on the company, visit the web site, www.kinesysinc.com, or call Henk Barreveld in the Netherlands at +31 (30) 233 2331, or Dave Huntley in the US office +1 (707) 766-8855.
About Intercon Technology, Inc.
Founded in 1986, Intercon Technology`s core business is centered on delivering semiconductor capital equipment for singulation in final manufacturing of semiconductor devices. Intercon excels in identifying market opportunities then applying our technology to provide the market with industry leading products and services. Intercon holds patents in singulation and continues to differentiate technology by developing and integrating innovative solutions to new packaging challenges. More information about the company and its products is available at www.intercontechnology.com.
About Electroglas, Inc.
Electroglas is a supplier of innovative probers, prober-based test handlers, test automation software and services that improve the overall effectiveness of semiconductor manufacturers` wafer and device testing processes by delivering faster answers to questions about device quality, manufacturing performance and corrective action needed. Headquartered in San Jose, California, the company has been a leading equipment provider to the semiconductor industry for over four decades, and has an installed base of more than 15,000 systems worldwide. Electroglas` stock trades on the NASDAQ National Market under the symbol "EGLS." More information about the company and its products is available at www.electroglas.com.
Contact:
Contact: Chris Cook
Company: Fourth Estate Public Relations Network
Voice: 510-595-6836
Email: ccook@fourthestatepr.com
Contact: Dave Huntley
Company: KINESYS Software, Inc.
Voice: 707-766-8855
Contact: Chris Winkler
Company: Intercon Technology, Inc.
Voice: 408-778-5992
Email: cwinkler@intercontechnology.com
Contact: Cristie Lynch
Company: Electroglas, Inc.
Voice: 408-528-3167
Email: clynch@electroglas.com
Contact: Jennifer Anselmo
Company: Loomis Group
Voice: 415-882-9494
Email: anselmoj@loomisgroup.com
--------------------------------------------------------------------------------
Source: KINESYS Software, Inc.
DurchsuchenBeitrag zu dieser Diskussion schreiben
Zu dieser Diskussion können keine Beiträge mehr verfasst werden, da der letzte Beitrag vor mehr als zwei Jahren verfasst wurde und die Diskussion daraufhin archiviert wurde.
Bitte wenden Sie sich an feedback@wallstreet-online.de und erfragen Sie die Reaktivierung der Diskussion oder starten Sie eine neue Diskussion.
Meistdiskutiert
| Wertpapier | Beiträge | |
|---|---|---|
| 80 | ||
| 29 | ||
| 29 | ||
| 21 | ||
| 20 | ||
| 19 | ||
| 15 | ||
| 13 | ||
| 12 | ||
| 11 |
| Wertpapier | Beiträge | |
|---|---|---|
| 11 | ||
| 10 | ||
| 10 | ||
| 10 | ||
| 9 | ||
| 9 | ||
| 9 | ||
| 8 | ||
| 7 | ||
| 6 |
